Failure Analysis OFI Engineer

Job Title

The primary function of this position is to apply failure analysis methods and techniques to provide timely and accurate support for failure analysis submissions utilizing OFI (Optical Fault Isolation) tools, primarily Photon and Thermal emission type.

Here's What You'll Be Responsible For:

• Conduct physical failure analysis from low yield lots, baseline material, qualifications, and customer requests.
• Identify the cause of failure by performing the sample selection, identifying the optimal analysis techniques to apply to ensure fast and accurate results for both internal and external customers.
• Support manufacturing and engineering teams with physical failure analysis results for new process and product introduction, and product transfer activities with Integration and Process Engineering teams.
• Represent the Analysis Engineering department in foundry customer meetings providing on time analysis results.
• Analyze electrical as well as imaging results to find the root cause of issues and publishing them to team members and customers.
• Recommend analysis approach based on customer's failure mode data as well as our own electrical isolation results and abilities.
• Generate and compile quality FA reports to internal and external customers to assist in issue resolution.

Here's what you'll need:

• B.S. to PhD in Electrical/Electronic Engineering, Material Science, Physics or closely related discipline.
• Good understanding of semiconductor FinFET fabrication process and semiconductor device physics (e.g Transistor, PN Junctions).
• Basic knowledge and understanding of wafer/die level semiconductor Automated Test Equipment (ATE) tests and FA methodologies.
• Strong analytical thinking and problem-solving ability.
• Strong project management, written and verbal communication skills. Teamwork oriented player with good communication and interpersonal skills.
• Able to work in fast paced and multi-tasking environment.
• Able to refine complex FA data into Fab language summary in generating FA report is a plus.
• Hands-on experience on FA tools and techniques (SEM, FIB, PVC, OBIRCH & PEM) or ATE systems such as Teradyne UFLEX, Advantest V93K or T2000 is a plus.
• Able to interpret FA and electrical ATE test data from die level down to transistor level is a plus.
• Able to interpret and understand Wafer Level Reliability stress data such as TDDB, HCI, HTOL etc is a plus.
• Experience with layout software (Camelot and/or Avalon) is a plus. Experience in handling customer returns FA is a plus.
• Experience in developing new FA techniques and automation scripts using Python is a plus.

The current base salary range for this role is between $76,000 - $145,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

We offer a comprehensive benefits package, including:

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives and MORE

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

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