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Process Development Engineer, Die Fabrication

Job in Temecula, Riverside County, California, 92591, USA
Listing for: Skorpios Technologies, Inc.
Full Time position
Listed on 2026-05-06
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer, Quality Engineering, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Description

The Die Fabrication Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.

  • Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments, and adjust or optimize processes for Fab Operation.
  • Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality.
  • Guide and assist Process Technicians through challenging process steps.
  • Analyze metrology results and disposition lots based on data and pass/fail criteria.
  • Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team.
  • Provide effective pass-downs to support uninterrupted operation in the Die Fabrication area.
  • Sustain and improve processes for semiconductor bars and die fabrication.
  • Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality and product yields.
  • Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment.
  • Assure that the manufactured products conform to specifications and application requirements.
  • Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations.
  • Sustain existing processes in the areas of, Die Fabrication, wafer scribing, pick and place of chips, chips-to-wafer bonding, wafer dicing, bar dicing, and bar polishing, recipe creations, microscope inspections, chip placement control, wafers, bars, and chips defects control, and relevant metrology for process control.
  • Create and maintain operating specifications for production processes and equipment.
  • Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.
Requirements Work Environment

80%+ of work is performed in the Fab, which is a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.

Bachelor’s or Master’s degree in Mechanical Engineering, Material & Science, Physics or Chemistry with hands‑on lab experience

  • Processing experience in a fab or a lab in the areas of Mechanical Engineering using robotics and programming
  • Ability to make technical mechanical drawings using Solid Works
  • Programming experience with Visual Basic, Excel Macros, and/or Python
  • Experience and good understanding of statistical concepts
  • Basic understanding of algebraic concepts
  • Data extraction, analysis, and reporting experience
  • Basic understanding of Die Fabrication processing
  • Ability to troubleshoot basic problems and address root causes
  • Ability to understand all maintenance activity details required to ensure a healthy and repeatable process
  • Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines.
  • Ability to operate robots, processing tools, write and run process recipes, inspect wafers/bars/chips under the microscope, and perform basic characterization related to Die Fabrication processing such as particles / defects metrology, and thickness / uniformity metrology
  • Must be able to work offset shifts:
    Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays)
Preferred

Education and Experience

Bachelor’s or Master’s degree with strong hands‑on lab experience

Experience working on hands‑on projects

Work Authorization/Security Clearance Requirements

Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.

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