Senior Engineer, RF Design in Temecula

Senior Engineer, RF Design role is responsible for supporting the development of next Si-Photonic Data Communications solutions in Skorpios’ Sub System engineering team. The Senior Engineer, RF Design will engage in simulation, data analysis, and product development of Module and/or Co-Packaged HPIC based products.

• Design, Model and simulate Micro Strip / Stripline Transmission lines up 120
  
  Ghz
• Model and simulate resistance and capacitance effects from EAM and MZM Modulators, Photodiodes and Laser Diodes to provide improved RF performance of the components into integrated circuits
• Perform impedance matching over large frequency range
• Establish Netlists and perform DRC for Designs and Layouts
• Direct HPIC Layout and PCB Layout of designed components
• RF device testing and electrical/optical s-parameter measurement and characterization
• DOE Design and Design Validation Testing
• Design Review Support and Presentation
• Design for Manufacturability (DFM).
• Establish schematics designs for PCBA
• Using computer software to design RF components

• Ability to work in an integrated and diverse team environment.
• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
• Good communication skills. Ability to present complex problems to internal peers as well as potential customers
• RF design circuitry skills
• Problem solving and trouble shipping skills
• Proficiency with Microsoft Excel
• Proficiency with HFSS and ADS Software Design Tools
• Interpersonal, verbal and written communication skills

• 10+ years' experience
• MS or Ph.D in Electrical Engineering, Photonics or a related discipline with emphasis in optical communications and high-speed optical components.
• TIA and modulator driver understanding a must.
• Experience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devices, ceramic and organic substrates.
• Experience with RF design, simulation of 50
  
  Ghz+ transmission lines on ceramic or organic substrates with wire bond and/or Flip Chip Bumping.
• Experience Converting Paper Designs into Layout and components either with customer owned tooling, or 3rd Party contractors.
• Experience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
• Strong background with semiconductor optical devices such as laser, detectors, modulators and other integrated waveguide devices along with a working level understanding of associated electronic circuitry.
• Experience meeting development schedules, preparing design reviews, and communicating complex solutions to a multi-disciplinary team.

• Desired are candidates with significant industrial experience in the optical components industry.
• JMP or Mini-Tab experience

Authorization may be required to release covered technology to employees who are not U.S., U.S. lawful permanent, asylees, or refugees.