Process Development Engineer, Dry Etch; Jr., Mid, Sr

Responsibilities

• Partner with Integration Engineers, Customers, and other Development Engineers to execute experiments and adjust or optimize processes for Fab operation.
• Collaborate with Product Engineering and Integration to ensure effective new product and process introductions and consistent device performance and quality.
• Guide and assist Process Technicians through challenging process steps.
• Analyze metrology results and disposition lots based on data and pass/fail criteria.
• Report and summarize metrology analysis results, providing guidance to Integration Engineering and Process Development teams.
• Provide effective pass-downs to support uninterrupted dry‑etch operations.
• Sustain and improve wafer fabrication processes.
• Work with equipment engineering, operations, and management to improve cycle time, tool availability, quality, and product yields.
• Document and preserve knowledge of codes and standards applicable to assigned production equipment using document control, process work instructions, and manufacturing execution systems.
• Ensure manufactured products conform to specifications and application requirements.
• Resolve deviations or technical issues with the Senior Development Engineering team by establishing hypotheses, designing experiments, identifying root causes, implementing corrective actions, documenting process improvements, and training operations.
• Maintain existing processes in Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM), Barrel etching, and related dry‑etch metrology such as ellipsometry or profilometry.
• Create and maintain operating specifications for production processes and equipment.
• Monitor process health with Statistical Process Control (SPC) and respond to out‑of‑control events following action plans.

• Experience in a fab with dry‑etch processing, including RIE, DRIE, MRIE, ICP, and Microwave Ashing.
• Experience with Statistical Process Control (SPC).
• Basic understanding of algebraic concepts.
• Data extraction, analysis, and reporting experience.
• Basic understanding of semiconductor processing.
• Ability to troubleshoot basic problems and address root causes.
• Ability to understand maintenance activity details required for a healthy and repeatable process.
• Ability to plan, prioritize, and monitor multiple overlapping tasks to meet goals and timelines.
• Ability to operate processing tools, write and run dry‑etch recipes, inspect wafers under a microscope, and perform basic characterization related to dry‑etch processing (particles/defects metrology, thickness/uniformity metrology).
• Must be able to work offset shifts:
  Front‑End Days (Sundays‑Thursdays) or Back‑End Days (Tuesdays‑Saturdays).
• BS in Electrical Engineering, Materials Science, Physics, Chemistry, or related plus 9 years; MS plus 7 years; or Ph.D. plus 4 years of experience.

• Hands‑on mindset
• Excellent communication skills
• Collaboration
• Quick learner
• Strong interpersonal skills
• Self‑starter
• Prioritization
• Accountability
• Innovative

80%+ of work is performed in the Fab, which is a temperature‑controlled cleanroom environment that requires the use of a full‑body gown, over‑boots, over‑hood, safety glasses, and other personal protective equipment (PPE). Frequent gowning and de‑gowning, static noise, and alarms (auditory and flashing lights) can be expected. Frequent interruptions, conversational noise, and a high‑speed work pace may occur.

• Frequently stationary, often sitting or standing for prolonged periods (up to 3 hours).
• Frequently viewing a computer monitor for prolonged periods (up to 3 hours).
• Frequently walking around the Fab for prolonged periods (up to 3 hours).
• Occasionally required to push or pull 50+ lbs objects, such as tool components.
• Occasionally required to lift 50+ lbs and occasionally carry that amount short distances.
• Occasionally required to reach, bend, twist, squat, kneel, and stoop to access and work on tools in the Fab.
• May involve repetitive motions with wrists, hands, or fingers.
• May require different positions…