×
Register Here to Apply for Jobs or Post Jobs. X

Lead Product Manager, Advanced Flip Chip Packaging

Job in Tempe, Maricopa County, Arizona, 85285, USA
Listing for: Semiconductor Engineering
Full Time position
Listed on 2026-08-11
Job specializations:
  • Business
  • Engineering
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below

Amkor is seeking a Product Manager for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This role blends deep technical knowledge with project management, strategic planning and direct customer interactions for new product development, qualification and mass production of advanced flip chip products.

You will own multiple programs from business and technical perspectives, align roadmaps, drive cost reductions and revenues, and coordinate with engineering, suppliers and

#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary