More jobs:
Substrate IC Package Designer — High-Speed Interposers
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-08-07
Listing for:
black.ai
Full Time
position Listed on 2026-08-07
Job specializations:
-
Design & Architecture
-
Engineering
Electronics Engineer
Job Description & How to Apply Below
Syenta, in Tempe, is seeking a senior substrate IC package designer to lead large-format interposers and high-density layouts that enable advanced packaging architectures for high-performance processors. You will drive signal integrity and power integrity, coordinating with process, materials and hardware teams to align designs with fabrication capabilities.
The role requires deep expertise in high-speed signal design and mastery of Allegro Package Designer, with opportunities to shape internal
#J-18808-LjbffrTo View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×