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Director, Chiplet & FCBGA Packaging Strategy

Job in Tempe, Maricopa County, Arizona, 85285, USA
Listing for: Semiconductor Engineering
Full Time position
Listed on 2026-02-23
Job specializations:
  • Engineering
Job Description & How to Apply Below
A leading semiconductor company in Tempe, AZ is seeking a Business Unit Product Manager to drive program management and manage key customer accounts in Advanced FCBGA Packaging. This role involves working with customer teams on product assembly, reliability, and manufacturing processes. Candidates should have a Bachelor's degree in Engineering and over 10 years of semiconductor packaging experience. This position offers a hybrid work schedule and requires strong communication and project management skills.
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