Principal Process Engineer

Application Window

Closing on 7 Jun 2026.

Lead the development and transfer of stable, cost‑effective, and scalable microelectronic packaging processes—including Printed Circuit Board Assembly and Wafer Level Packaging—into manufacturing. The Principal Process Engineer supports equipment and processes such as underfill dispense, pick and place, solder paste dispense, reflow, epoxy cure, laser cutting, automated inspections, and more. This role requires deep understanding of process interactions, metrology, and design integration to advance the state of the art in microelectronic assembly.

• Scouting and feasibility work; material selection; process and equipment selection.
• Design, install, and evaluate tooling and fixtures to ensure alignment with production requirements.
• Develop and validate manufacturing processes that support statistical process control, including measurement system development.
• Perform equipment qualification (IQ), process validation (OQ and PQ), and gage R&R studies (TMV).
• Apply statistical methods and design experiments to implement process improvements.
• Monitor, root‑cause, and resolve process yield issues.
• Provide technical and sustaining engineering support in a manufacturing environment.
• Troubleshoot and resolve equipment and process production issues.
• Generate and maintain documentation per quality system regulations.
• Ensure processes and procedures comply with regulatory requirements.
• Provide inputs to design teams and contribute to advancing microelectronic assembly technology.
• Other duties as assigned.

Required: Education and experience combinations:

Nice to have: Advanced degree in Mechanical Engineering or Materials Science; experience developing a process from concept to transfer in manufacturing; experience in high‑volume facilities; familiarity with DRM / DFSS, Lean Sigma, Green or Black Belt certification; knowledge of DOE, statistical analysis tools (e.g., Minitab, JMP); understanding of SPC principles and control charts; aptitude to program and troubleshoot automated assembly equipment, visual inspection and automated metrology tools;

laser application experience (laser selection, optics packaging, joining, cutting, marking). For Baccalaureate degrees earned outside the United States, a degree satisfying 8C.F.R. §214.2(h)(4)(iii)(A) is required.

Work requires independent mobility, interaction with a computer, and communication with peers and coworkers. Reasonable accommodations are available for individuals with disabilities.

Principal‑level roles and above may qualify for U.S. work‑authorization sponsorship (e.g., H‑1B, TN, J) when specialized expertise aligns with long‑term business needs. Roles below the principal level require unrestricted U.S. work authorization at the time of hire and for the duration of employment.

Medtronic offers a competitive salary range (USD$ – $) and flexible benefits package, including health, dental, vision, HSA, FSA, life insurance, long‑term disability leave, tuition assistance, 401(k) with match, short‑term disability, paid time off, holidays, Employee Stock Purchase Plan, and Employee Assistance Program. Eligible positions also receive a Medtronic Incentive Plan (MIP).

It is the policy of Medtronic to provide equal employment opportunity (EEO) to all persons regardless of age, color, national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity, or any other characteristic protected by federal, state or local law. Medtronic will provide reasonable accommodations for qualified individuals with disabilities.