Director, Chiplets & FCBGA Packaging PM
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-06-18
Listing for:
Semiconductor Engineering
Full Time
position Listed on 2026-06-18
Job specializations:
-
Engineering
Job Description & How to Apply Below
Semiconductor Engineering is seeking a Business Unit Product Manager for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. This role involves program management and managing key customer accounts while supporting process development and qualifications. Candidates should have extensive experience in semiconductor packaging and project management.
The ideal applicant will possess strong communication skills and work well independently. A Bachelor’s degree in Engineering is required, alongside 10+ years of relevant industry experience. This position offers a hybrid work schedule.
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