Sr Package Design Engineer

Renesas is a global semiconductor company delivering embedded solutions across microcontrollers, analog, power, and SoC products. Our technologies support critical applications across automotive, industrial, infrastructure, and IoT markets, helping enable smarter, safer, and more efficient systems.

Renesas is seeking a Sr. Staff Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high‑reliability power applications. This role will focus on hermetic, ceramic, metal, radiation‑tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in‑house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high‑reliability environments.

• Develop hermetic, ceramic, metal, radiation‑tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high‑reliability power applications.
• Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
• Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas’ in‑house Palm Bay assembly site.
• Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
• Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
• Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
• Maintain technical expertise on advances in hermetic, ceramic, metal, radiation‑tolerant, and Class P plastic packaging technologies.
• Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long‑term package strategy.

• 5–12 years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation‑tolerant, or Class P plastic packaging.
• Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
• Familiarity with high‑reliability, aerospace, commercial space, or defense‑related semiconductor packaging requirements.
• Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
• Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
• Strong communication, analytical, presentation, and cross‑functional collaboration skills.
• Familiarity with MIL‑STD‑883, MIL‑PRF‑38535, and MIL‑STD‑750 standards.

Bachelor’s, Master’s, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.