Senior IC Layout Lead
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-07-14
Listing for:
Amazon Web Services (AWS)
Full Time
position Listed on 2026-07-14
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer, Quality Engineering
Job Description & How to Apply Below
Annapurna Labs (U.S.) Inc. in the United States is seeking a Senior Package Layout Engineer to lead end‑to‑end physical design of IC packages for next‑gen ML and data center ASICs.
You will own package layout from floor planning through tape‑out, collaborating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets. Responsibilities include driving 2.5D/3D packaging architectures, defining floor plans, and ensuring DFM and yield goals.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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