Power SiP & Packaging Design Lead
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-08-22
Listing for:
Renesas
Full Time
position Listed on 2026-08-22
Job specializations:
-
Engineering
Job Description & How to Apply Below
Renesas is seeking a senior packaging engineer in Tempe to design and develop power SiP/module interconnects, WLCSP and multi-chip packages. You will work with wafer-level processes, Cu RDL and backside metal deposits, and coordinate with OSAT/CMs to optimize production and quality.
The role requires 10–15 years in package development, strong analytical skills, and the ability to drive DOE studies, qualification tests, and ramp-up activities across cross-functional teams.
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