×
Register Here to Apply for Jobs or Post Jobs. X

Senior 3D​/5D Packaging Design Engineer

Job in Tempe, Maricopa County, Arizona, 85285, USA
Listing for: black.ai
Full Time position
Listed on 2026-08-26
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 140000 - 190000 USD Yearly USD 140000.00 190000.00 YEAR
Job Description & How to Apply Below
Position: Senior 3D/2.5D Packaging Design Engineer

Syenta is seeking a Senior Advanced Packaging Design Engineer to lead physical layout and floor planning for 2.5D/3D interposers and high-density RDLs. You will drive die-to-package and package-to-board co-design, collaborating with ASIC, SI, and PI teams to ensure robust designs.

With 5+ years in semiconductor packaging, you will tackle design verification, DFM collaboration, and reliability optimization to push performance while managing manufacturability and thermal/structural challenges.

#J-18808-Ljbffr
Position Requirements
10+ Years work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary