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Senior 3D/5D Packaging Design Engineer
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-08-26
Listing for:
black.ai
Full Time
position Listed on 2026-08-26
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Syenta is seeking a Senior Advanced Packaging Design Engineer to lead physical layout and floor planning for 2.5D/3D interposers and high-density RDLs. You will drive die-to-package and package-to-board co-design, collaborating with ASIC, SI, and PI teams to ensure robust designs.
With 5+ years in semiconductor packaging, you will tackle design verification, DFM collaboration, and reliability optimization to push performance while managing manufacturability and thermal/structural challenges.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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