Director, fcCSP Packaging & NPI Strategy
Listed on 2026-10-06
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Engineering
Amkor is seeking a Product Engineer/Manager with IC package development and business acumen, emphasizing fcCSP technologies across high-performance, automotive, and related package types. This role leads product development, pricing, NPI, and customer negotiations from inception through qualification and production.
Based in Tempe, AZ with a hybrid schedule, the position collaborates with customers and factory teams to translate requirements into reliable, cost-optimized package solutions and
Are you ready to take on the Director, fcCSP Packaging & NPI Strategy role at Semiconductor Engineering?
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If your experience matches this role, we encourage you to apply.
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The position is based in Tempe, AZ, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 140..
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