VP, Head of fcCSP Business Unit

Job Title:VP, Head of fcCSP Business Unit
Job :8997
Location:Tempe, Arizona

• Lead and grow the company’s global fcCSP business, establishing strategies that drive sustainable revenue growth, market share expansion, and customer satisfaction.
• Manage and develop the fcCSP organization, ensuring appropriate staffing, succession planning, capability development, and organizational effectiveness to support future growth.
• Promote the company’s packaging technologies directly to new and existing customers, identifying opportunities to expand business and accelerate adoption of the company’spackage portfolio.
• Drive year-over-year revenue growth within the fcCSP Business Unit while identifying opportunities for broader growth across the company’sproduct portfolio.
• Serve as the executive interface for key fcCSP customers, leading commercial, technical, capacity, roadmap, and escalation discussions.
• Partner with the company’sadvanced product development teams to successfully transition new packaging technologies into high-volume manufacturing, including cost analysis, capital investment planning, manufacturability assessments, customer qualifications, and production ramp execution.
• Lead strategic capacity planning and capital investment discussions to support customer growth requirements and maximize business performance.
• Develop and execute product roadmaps, marketing strategies, and business plans to support growth in existing and emerging markets.
• Ensure effective processes and systems are in place to manage multiple customer programs, monitor performance metrics, and drive operational excellence.
• Foster a high-performance culture focused on accountability, collaboration, innovation, customer success, and continuous improvement.
• Build, mentor, and develop future leaders within the organization while creating a strong talent pipeline for long-term business success.
• Travel to customer locations and the company’smanufacturing sites as needed to support business objectives.

• Bachelor’s degree in Engineering, Science, or a related technical discipline; advanced business degree (MBA or equivalent) preferred.
• Minimum of 15 years of leadership experience within semiconductor manufacturing, packaging, or related industries.
• Demonstrated success leading large, customer-facing business organizations with accountability for revenue growth, profitability, and organizational development.
• Proven experience managing business strategy, customer relationships, staffing, and organizational growth in a complex, global environment.
• Strong technical understanding of semiconductor packaging technologies, materials, substrates, manufacturing processes, and specifically fcCSP packaging.
• Previous experience with P&L ownership or significant business management responsibility is highly desirable.
• Demonstrated ability to lead cross-functional teams and execute effectively in a highly matrixed organization.
• Strong program management, strategic planning, negotiation, and executive communication skills.
• Proven track record of delivering year-over-year customer revenue growth and expanding strategic customer relationships.
• Exceptional leadership, organizational development, stakeholder management, and talent development capabilities.
• Excellent written, verbal, presentation, and interpersonal communication skills.
• Proficiency with Microsoft Office applications, including Excel, PowerPoint, Outlook, and Teams.
• Ability to travel approximately 15% domestically and 15% internationally.