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Director, Chiplets Packaging & Programs
Job in
Tempe, Maricopa County, Arizona, 85285, USA
Listed on 2026-07-13
Listing for:
Semiconductor Engineering
Full Time
position Listed on 2026-07-13
Job specializations:
-
Manufacturing / Production
Packaging Engineer
Job Description & How to Apply Below
Amkor in Tempe, AZ seeks a BU Product Manager for Advanced Chiplets/FCBGA packaging. The role centers on program management, key customer relationships, and driving internal process development and co‑development with offshore factories to support qualification and mass production.
Responsibilities include coordinating with BU teams on packaging technology promotions, risk analyses, cost modeling, and ramp planning, with a strong emphasis on cross‑functional execution and on‑time delivery.
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