Hardware Engineering Manager

In your career, let’s prove what’s possible.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value.

We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Date:
Jul 12, 2026

Location:

Tualatin, OR, US, 97062

Worker Category:
On-site Flex

You will be part of Lam Research’s Equipment Intelligence and Sensor Engineering organization within the Deposition Product Group (DPG). This team is responsible for developing next-generation sensing, imaging, and data-driven capabilities that enable differentiated performance across Lam’s product portfolio.

The organization focuses on integrating advanced sensor systems—including optical, thermal, acoustic, chemical, and multi-modal sensing—into semiconductor capital equipment to enable real-time visibility, control, and optimization. This includes development of modular sensor platforms, edge compute architectures, and scalable system integrations that support both new product introduction (NPI) and installed base enhancement.

Our teams operate at the intersection of mechanical systems, optics, electronics, controls, software, and data science - partnering globally to deliver robust, high-performance solutions that accelerate innovation, improve tool intelligence, and enable next-generation capabilities across all Lam product lines.

The organization operates in a matrix structure, where mechanical, electrical, optical, and software engineers collaborate closely across shared programs and platforms, requiring strong cross-functional alignment and shared ownership of outcomes.

As a Hardware/ Mechanical Engineering Manager within the Equipment Intelligence and Sensor Engineering team, you will play a critical leadership role in enabling the mechanical architecture, integration, and deployment of advanced sensor systems across Lam platforms. Your work will directly impact the scalability, reliability, and performance of sensing solutions that drive equipment intelligence—enabling improved process control, fault detection, and system optimization.

You will lead a team responsible for designing and integrating complex opto-mechanical and electro-mechanical assemblies, working in close partnership with Electrical Engineering, Firmware Engineering, and other functional teams to ensure cohesive system architectures to build sensor sub-systems that are robust, manufacturable, and seamlessly integrated at the system level. Success in this role requires effective leadership within a matrix organization, influencing functional boundaries while maintaining accountability for mechanical deliverables.

This role requires balancing deep technical…