Structural​/ Thermal Modeling Engineer 3

In your career, let’s prove what’s possible.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value.

We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Structural/ Thermal Modeling Engineer 3

Date:
Jul 11, 2026

Location:

Tualatin, OR

Worker Category:
On-site

In the Global Products Group, we are dedicated to excellence in the design and engineering ofLam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry.

We move atoms that move the world.

At Lam Research, we create equipment that allows chipmakers to build device features more than 1,000 times smaller than a grain of sand. This tiny scale has a huge impact. Virtually every leading-edge chip inside the electronic products you use every day (TVs, smartphones, laptops, cars—even medical devices) has been made using our equipment.

As one of the world’s most trusted suppliers in the semiconductor equipment industry, we’re transforming technology. Our equipment places atoms so precisely that nearly every chip today is made using our innovations.

To build a prosperous career, start with an atom.

Should you choose to walk the path historically driven by Moore’s law, your primary job function will involvecutting edge R&D activities in the Semiconductor Equipment Industry. If solving challenges no one has faced before or attempted are of interest to you, then Lam Research is the company for you.

• Developing physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry. Experience in commercial software like ABAQUS, ANSYS, NASTRAN, COMSOL, etc., is highly desirable.
• Data driven modeling - Juncture of physics-based modeling with data-driven, AI/ML methods:
  • Developing methods for translating tool operational data into improved engineering designs
  • Utilizing DOE, Optimization, and statistical methods to correlate Simulation data to experimental data.
  • Stochastic optimization tools to bridge between simulation and experiments.
  • Predict, measure and analyze the experimental data of mechanical designs, process specification and software programs for semiconductor manufacturing equipment.
  • Uncertainty Quantification & propagation, sensitivity analysis, statistical inference for model calibration, decision making under uncertainty.
• Developing and maintaining live multi-physics models
• Multi-scale modeling from nano, meso to macro levels
• Provide design improvements of in-service tools based upon quantitative field measured failure data and less quantitative quality metrics as measured by Lam Research.
• Use advanced statistical, probabilistic and forecasting methods to best quantify design and performance of overall system.
• Provide written reports and oral presentation of results to design teams and management.
• Work directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans.

Minimu…