Sr Mechanical Engineer - Electronics Packaging Security Clearance

Position: Sr Mechanical Engineer - Electronics Packaging with Security Clearance
Date Posted:

Country:
United States of America

Location:

US-AZ-TUCSON-M10 ~ 3360 E Hemisphere Loop ~ BLDG M10
Position Role Type:
Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements:
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Security Clearance Type:
DoD Clearance:
Secret
Security Clearance Status:
Active and existing security clearance required after day 1 At Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat.

Our team solves tough, meaningful problems that create a safer, more secure world. The Mechanical Engineering group in the Shipboard Effectors Department seeking an experienced Mechanical Engineer REA (Responsible Engineering Authority) to contribute to the mechanical technical team for a common Guidance Unit (Stack). This role is primarily responsible for maintaining mechanical Technical Data Package (TDP) configuration changes, driving producibility updates, supporting failure investigations, supporting alternate component and material evaluations and testing, providing support across the full spectrum of mechanical, environmental, structural, and thermal engineering disciplines.

Additionally, the mechanical engineer will be part of a small team of mechanical engineers, ensuring successful support of both production and development efforts. This is an onsite role and located in Tucson, Az. What You Will Do
* Serve as the mechanical engineer to support documentation, mechanical, environmental, structural, and thermal aspects of different stack configurations.

* Contribute to a small team of mechanical production REAs supporting mechanical production and development efforts, ensuring technical excellence and alignment with program objectives.

* Oversee and manage all mechanical, slice and stack TDP configuration changes, ensuring updates address producibility improvements, yield optimization, and design enhancements.

* Lead efforts to analyze and incorporate producibility updates into designs to improve manufacturing efficiency and reduce production defects.

* Support failure investigations, conducting root cause analyses and implementing corrective actions to resolve systemic mechanical issues.

* Provide technical guidance on mechanical design, analysis, and integration challenges, ensuring compliance with program requirements and performance specifications.

* Drive design for manufacturability (DFM) practices and lead efforts to identify and implement cost-saving opportunities in mechanical assemblies.

* Collaborate with cross-functional teams, including systems engineering, quality, and supply chain, to resolve mechanical engineering challenges and ensure seamless integration of stack configurations.

* Provide oversight and review of hardware performance during environmental testing, including structural and thermal analysis, to ensure compliance with design requirements.

* Maintain and update mechanical TDPs, processing engineering change requests such as IRs, CNs, SRs, and variances to ensure accurate and current documentation.

* Positive attitude toward being mentored by experienced technical team members and subject matter experts within Raytheon. Qualifications You Must Have:
* Typically requires a Bachelor's Degree in Science, Technology, Engineering, and Mathematics (STEM) and a minimum of 5 years of prior relevant experience or an advanced degree in a related field and minimum 3 years experience.

* Five years' experience in mechanical design and design documentation

* Experience with 3D CAD tools (modeling and drawing)

* Experience with Geometric Dimensioning & Tolerancing (GD&T) per ANSI Y14.5

* Experience with the packaging of electronics assemblies

* Knowledge of environmental testing and hardware performance validation, including structural and thermal analysis.

*…