Engineering Assembly Technician

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H Tucson, AZ, US

14 days ago Requisition

Job Purpose:

Responsible for assembly of high-power laser diode devices. Perform precision manual die attach and mechanical assembly. Responsible for assisting Product and R&D Engineers with new product introduction (NPI) and development prototypes. Responsible for performing hands-on assembly of high-power laser diodes devices and support their release to manufacturing. Provide “second person” assistance on assemblies requiring more skill or precision. Support production processes as needed.

Duties:

• Perform manual die attach and laser diode array (LDA) assembly with precision alignment under 20X to 50X magnification.
• Work with Engineering staff on new design assemblies and protocols.
• Analyze and report technical data to ensure products meet requirements.
• Ability to perform manual die attach for new design multi bar stacks, single emitter, and multi emitter chips and bars.
• Monitor all manual die attach processes and provide technical support to help to resolve any issues.
• Investigate and troubleshoot product deficiencies and failures.
• Ability to perform package assembly for single emitter and multi-emitter packages
• Perform and high magnification inspection for any defects that occur during reflow or assembly process.
• Assist in defining and documenting newly introduced processes.
• Use manual and automated wire-bonding systems to apply wire bonds to laser diode packages.
• Ability to perform LIV test on high powered laser diodes at chip-on-submount and completed assembly levels.
• Ability to accurately enter data into Manufacturing interfaces and Excel spreadsheets.
• Ability to operate Coordinate Measuring Machine (CMM).
• Ability to operate and program high-performance dicing saws.

Skills/

Qualifications:

Associates degree in Electronics or minimum of 5 years of related experience. Attention to detail and high level of mechanical dexterity is required. Detail oriented, mechanical dexterity. Hands-on experience (2 to 5 years) working with lasers as a laser tech is preferred. Must have excellent communications skills. Strong computer skills (MS Excel, MS Access) is required. Experience in semiconductor manufacturing environment is highly desired in working in 10,000 class clean room environment.

Must wear bunny suit with face and head mask and gloves for entire production shift. Safety glasses required for some operations. Ability to perform electro-mechanical assembly in accordance with workmanship standards. Stand or sit at workstation for entire production shift.

Leonardo is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability status, protected veteran status, or any other characteristic protected by law.

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NOTE:

The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.]

Here are the hiring process steps and what you can expect from us:

Step 1:
Application Review:

Upon submitting your application, it is made available to the recruitment team to review and ensure you meet the basic qualifications.

Step 2:
Interview:

If you have been identified to move forward in the process, you may be invited to participate in a one-on-one or panel interview. The interview format can be a phone call, in-person, or virtual meeting.

Step 3:
Offer:

If you reach this stage of the interview process, congratulations! You will be provided an offer to join the Leonardo Electronics US Inc. team. The offer will include details about your salary, benefits package and start date.