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Sr. Technician - Microelectronics Failure Analysis

Job in Essex Junction, Chittenden County, Vermont, 05453, USA
Listing for: GlobalFoundries
Full Time position
Listed on 2026-05-05
Job specializations:
  • Engineering
    Quality Engineering, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 48200 - 83200 USD Yearly USD 48200.00 83200.00 YEAR
Job Description & How to Apply Below
Location: Essex Junction

About Global Foundries

Global Foundries is a leading full‑service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

Summary of Role

Global Foundries Fab 9 is seeking a Senior Technician - Microelectronics Failure Analysis with expertise in Scanning Electron Microscopy (SEM) to join our advanced analytical laboratory in Essex Junction, Vermont. This hands‑on role supports high‑volume semiconductor manufacturing, yield learning, and root‑cause determination through detailed physical failure analysis at the device and process level. The SEM technician is expected to operate with a high degree of independence, serve as a technical expert for SEM‑based analysis, and actively contribute to analytical method development, tool ownership, and mentoring within the lab.

Essential

Responsibilities
  • Independently execute complex, routine and non‑routine SEM‑based failure analysis, from wafer level through final interpretation, in support of yield, reliability, and manufacturing investigations as well as process optimization and technology development
  • Perform advanced sample preparation for SEM analysis, including precision mechanical cleaving, mechanical polishing (cross‑section and planview), and FIB‑based site‑specific milling
  • Select and optimize SEM imaging conditions (e.g., voltage, current, detector selection, contrast mechanisms) to resolve subtle or ambiguous failure signatures
  • Interpret SEM results in the context of device structures, materials, and semiconductor process flows
  • Work with failure analysis engineers to help define optimal sample prep and analytical strategies
  • Develop, improve, and standardize SEM operating procedures, troubleshooting guides, and training documentation
  • Ensure thorough documentation of analytical results, imaging data, and tool status in lab reporting systems
  • Train and mentor junior technicians, sharing best practices in SEM operation, interpretation, and data quality
  • Promote strong safety, compliance, and continuous‑improvement culture in the lab environment
Other Responsibilities
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
  • Other duties as assigned by manager / supervisor
Required Qualifications
  • Education – associate’s degree (2‑year technical degree) in Engineering, Physics, Materials Science, Electronics, Semiconductor Manufacturing, Math or a related discipline OR equivalent military technical training
  • Experience – minimum of 4 years of relevant technical experience
  • Ability to clearly communicate technical findings to engineers and lab leadership
  • Fluency in English (both written and verbal)
  • Familiarity with advanced SEM techniques (e.g., low‑kV imaging, cross‑section analysis, material contrast techniques)
Physical Requirements
  • Ability to periodically lift up to 30 pounds to support preventive maintenance and tool sustainment activities
Preferred Qualifications
  • Hands‑on experience with SEM in a semiconductor failure analysis or process‑support role
  • Experience acting as SEM tool owner, lead technician, or primary technical contact for SEM platforms
  • Demonstrated ability to independently perform SEM analysis and associated sample preparation, including mechanical cleaving and/or cross‑section preparation
  • Experience supporting high‑volume manufacturing fabs and fast‑turn‑around root‑cause investigations
  • Working knowledge of TEM or optical failure analysis techniques (beneficial but not required)
Expected Salary Range

$48,200.00 – $83,200.00

The exact salary will be determined based on qualifications, experience and location.

Security Clearance

The role may require obtaining a U.S. Department of Defense Security Clearance at some time during employment. Acceptance of this role commits you to applying for such clearance if requested. You also acknowledge that Global…

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