Photonics Packaging Characterization Engineer; College Graduate

About Global Foundries

Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

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We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life‑long connections and skills.

This hands‑on packaging integration role will deliver industry leading electro‑optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co‑packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on assembly packaging inspection and characterization methods for SiPh Flip Chip packaging, including siph wafer level packaging features (v-grooves, cavities, bumps, RDL), assembly components (optical lens arrays, fibers, sockets, lids), and assembly process features (underfill fillets, chip edges).

Focus on development of innovative methods to ensure product and module assembly manufacturability, cost, reliability, and performance.

• Develop and lead advanced inspection & characteristic workflows for photonics packaging, including AOI, warpage analysis, and metrology across all assembly stages (die attach, underfill, lid attach, socket placement, fiber plug integration).
• Establish and transfer robust inspection, characterization, and quality methodologies into manufacturing, including packaging design rules, materials criteria, test structures, and participation in design reviews and FMEAs.
• Analyze data and partner cross‑functionally to resolve technical, quality, and yield issues while driving global standardization, qualification rigor, and continuous improvement initiatives (CIP).
• Ensure product quality, safety, and compliance by supporting standardized quality processes, environmental health & safety requirements, and consistent global execution.

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Education - Master’s degree or higher in Materials Science, Mechanical Engineering, Applied Physics, or related field from an accredited degree program.
• Experience –1 to 3 years of experience in semiconductor packaging, inspection, and physical characterization.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal)

• Prior related internship or co‑op experience
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills
• Hands‑on experience with photonics and advanced packaging technologies, including 2.5D, 3D, and 3.5D packaging, optical packaging, and failure analysis of electronic packages.
• Strong technical expertise in physical characterization and inspection, with experience using tools such as AOI, profilometry, SEM, X‑ray, and acoustic microscopy, along with advanced characterization methods.
• High curiosity with strong communication skills, including the ability to document work clearly in English and stay informed on global technology and commercial trends.

$65,400.00 – $

The exact salary…