MTS 3D Heterogenous Integration Engineer Job Essex Junction Vermont USA,Engineering

Location: Essex Junction

R&D Engineer

Global Foundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development.

Essential Responsibilities:

Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the Global Foundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the Global Foundries fabs.
Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
Drive data analysis, interpretation of results, and understanding of failure modes.
Identify and resolve process integration issues and related challenges.
Generate IP related to novel wafer integration and packaging technology.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Participate in hiring activities.
Mentor and guide new hires to assume their roles and responsibilities.
Other duties as assigned by manager.

Required Qualifications:

Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
MS degree with at least 5-6 years of prior related work experience.
In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
Must have at least an overall 3.0 GPA and proven good academic standing.
Language Fluency
- English (Written & Verbal).
Travel
- Up to 20%.

Preferred Qualifications:

Education – PhD education level preferred with at least 3-4 years of prior related work experience.
Demonstrated prior leadership experience internally or with an OSAT eco-system.
Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills.
Strong planning and organizational skills.

Expected Salary Range

$98,000.00 - $

The exact Salary will be determined based on qualifications, experience and location.