Packaging Integration Engineer; College Graduate

Overview

Global Foundries is a leading full‑service semiconductor foundry providing a unique combination of design, development, and fabrication services to technology companies worldwide. With facilities on three continents, Global Foundries enables technologies and systems that transform industries.

Global Foundries seeks a hands‑on Assembly Process Integration Engineer to deliver industry‑leading electro‑optical transceivers using the Photonix platform and advanced packaging 2.5D/3D co‑packaged optics form factors that meet customer requirements. The candidate will focus on tool‑process interactions throughout SiPh Flip Chip assembly, ensuring product reliability, packaging risk management, and design rule compliance.

Essential Responsibilities:

• Define process integration specifications for assembly flow of co‑packaged optics modules, driving toward cost, yield, and reliability targets.
• Establish manufacturing‑driven design rules.
• Ensure all packaged products meet standardized quality expectations via packaging design reviews, materials selection, and FMEAs of customer concepts.
• Drive SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Provide tools and complex analysis of quality issues and associated financial implications.
• Protect the business by ensuring all requirements are met and technology meets customer expectations to avoid costly redesigns.
• Standardize site‑based quality processes and ensure disciplined qualification through a consistent global qualification process.

Other Responsibilities:

• Perform activities safely and support Environmental, Health, Safety & Security programs.
• Travel up to 10% to other Global Foundries facilities as necessary.
• Perform project management and data analysis.
• Identify and resolve process integration issues.
• Develop custom or derivative processes to meet customer needs.
• Support new designs with module characterization and design‑rule development.
• Work with cross‑function teams to resolve technical and yield concerns.
• Develop and improve test structures for fast and rigorous characterization.
• Drive Continuous Improvement Plans to achieve organizational goals.

Required Qualifications:

• PhD or Master’s degree plus at least 2 years of experience.
• Experience with failure analysis, design of experiments, and packaging process integration.
• Experience bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Preferred Qualifications:

• Background in materials science, thermal, mechanical, or simulation.
• Validated record of photonic and electrical interconnect innovation and product release with an OSAT ecosystem.
• Expertise in chip package interaction for 2D, 2.5D, 3D, and 3.5D SiPh advanced packaging.
• Knowledge of global technology and commercial trends related to current and future technologies, designs, and manufacturing.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at  Requests will be considered on a case‑by‑case basis.

Global Foundries is fully committed to equal opportunity in the workplace and believes that cultural diversity enhances its business potential. Policies and processes for recruitment, selection, training, utilization, promotion, compensation, benefits, and termination are implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic specified by local, state, or federal law.