Low-Temperature Bonding Engineer

Job Summary

Global Foundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part of our Quantum Advanced Packaging team. This role will entail enabling next-generation assembly scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners. The primary responsibility of this position is to develop low-temperature bonding processes, support advanced die assembly technologies, and associated assembly equipment.

The engineer will drive process characterization, tool optimization, defect reduction, and integration activities required to support next-generation superconducting and cryogenic quantum packaging platforms.

• Develop and optimize low-temperature bonding processes for quantum packaging applications.
• Support assembly process development (In bonding, superconducting metal bonding, thermo-compression bonding, hybrid bonding, etc.).
• Characterize bond quality, electrical performance, mechanical integrity, and reliability through cryogenic operating conditions.
• Define process windows and critical-to-quality parameters for production-worthy assembly processes.
• Own assembly process modules from development through qualification.
• Execute process experiments and DOE activities to improve process capability and robustness.
• Work with test and systems teams to ensure assembled hardware meets cryogenic reliability across thermal cycles and electrical and RF/microwave integrity requirements.
• Work with equipment teams to define requirements for high-precision alignment/bonding tools and cryogenic-compatible materials handling.
• Develop deep understanding of tool capability versus quantum packaging requirements.
• Contribute to APPC and quantum packaging roadmap and capability build-out.
• Provide clear technical updates, data analysis, and reports to stakeholders.
• Support IP generation, publications, and conference contributions.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Take part in hiring of other Advanced Packaging team members.
• Mentor and guide new hires to assume their roles and responsibilities.
• Other duties as assigned by manager.

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related field from an accredited degree program.
• At least 4 years of prior related work experience.
• In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development and assembly.
• Strong problem solving and technical troubleshooting skills including expertise in design of experiment.
• At least a 3.0 GPA and proven good academic standing.
• Fluency in English (written and verbal).
• Up to 10% travel.

• Master’s degree preferred with at least 2 years of prior related work experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter, and the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

$85,000 - $146,000.

Global Foundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.