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Cryogenic Bonding Engineer — Quantum Packaging R&D

Job in Essex Junction, Chittenden County, Vermont, 05453, USA
Listing for: GlobalFoundries
Full Time position
Listed on 2026-07-19
Job specializations:
  • Engineering
    Packaging Engineer, Electronics Engineer, Research Scientist, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 85000 - 146000 USD Yearly USD 85000.00 146000.00 YEAR
Job Description & How to Apply Below
Location: Essex Junction

Global Foundries Fab9 in Vermont seeks a highly skilled R&D assembly engineer to join our Quantum Advanced Packaging team. You will develop low-temperature bonding processes and support advanced die assembly technologies for superconducting and cryogenic quantum packaging platforms.

You will drive process characterization, tool optimization, defect reduction, and integration activities, coordinating with test, systems, and equipment teams to ensure robust, production-worthy assembly processes and

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