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Senior Director, Optical Packaging Technology; OPT) Development
Job in
Essex Junction, Chittenden County, Vermont, 05453, USA
Listed on 2026-09-26
Listing for:
GlobalFoundries inc.
Full Time
position Listed on 2026-09-26
Job specializations:
-
Engineering
Systems Engineer, Quality Engineering
Job Description & How to Apply Below
Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
• Responsible for the profitability and growth of the entire or part of global business line
• Develops and implements programs & strategies that will successfully promote the organization's mission & meet financial objectives.
• Identifies target customers, maintains and strengthens external relationships including customers & other external authorities
• Accountable for and drives commitment; to compliance with all internal policies and legal regulations in every area of the organizations daily activity, including development of short and long-term plans, policies, and guidelines
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
• Work and collaborate other projects and/or assignments as needed.
See description for career level for general proficiency levels pertaining to Job Complexity, Accountability, Relationship Focus, and Knowledge, Skills & Abilities. These proficiency levels apply to all career levels. Some requirements may vary locally.
About the Role Global Foundries is hiring an Optical Packaging Technology (OPT) Development leader wit hin the Integrated Optic s ( IO) organization and is seeking a Senior Director. A successful candidate will define an organizational structure, recruit and develop the leadership team, and set the technical and operational strategy across advanced packaging, optics, and product engineering for GF's Integrated Optics portfolio .
The role is based in Burlington, VT and will partner within a matrixed global organization.
Key Responsibilities Own the technical strategy and roadmap for Optical Packaging Technology (OPT) Development, spanning advanced packaging, optics, and product engineering.
Lead Package Design & Assembly architecture decisions for optical/photonic modules, including substrate, interposer, and co-packaging approaches.
Drive Yield Enhancement programs, using statistical process control and root-cause analysis to close yield gaps in packaging and assembly.
Own Packaging Qualification & Reliability strategy, including qualification test plans, stress testing, and reliability modeling to meet customer and industry standards.
Direct the Optics function's technical roadmap, covering optics/laser solutions, optical alignment and fiber attach processes, and co-packaged/advanced optics integration architectures.
Guide Product Engineering technical investigations, including returns analysis and failure analysis (FA) methodology, to close the loop between field issues and process/design changes.
Partner with Test engineering to co-develop test strategy, coverage, and qualification requirements aligned to package and optical architecture.
Set technical requirements and provide engineering oversight for external assembly/test partners , reviewing process capability, yield, and quality data.
Evaluate and down-select advanced packaging and optical integration technologies (e.g., co-packaged optics, fiber attach methods, EIC/PIC integration schemes) for technology roadmaps.
Collaborate cross-functionally with Silicon Products Development on EIC/PIC and optical engine architecture to ensure package-silicon co-design alignment.
Required Qualifications Bachelor’s degree in engineering, Materials Science, Physics, or related field required; advanced degree (MS/PhD) strongly preferred.
15+ years of progressive experience in semiconductor or photonics packaging, with significant time in advanced packaging and/or optical/photonic integration.
Proven track record…
Position Requirements
10+ Years
work experience
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