Quantum NCG DHI Engineer

About Global Foundries:

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Global Foundries is seeking a motivated R&Dbonding integration engineer to become part of our Quantum Advanced Packaging team. This role will entail 3D heterogeneous integration (3

DHI) development including wafer-to-wafer and die-to-wafer bonding.

• Drive3
  
  DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materialssuppliersfor the Quantum Advanced Packaging projects.
• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.
• Developexpertisein the processes, materials and tooling leveragingavailable characterization resources.
• Drive amechanisticunderstanding of failure modes.
• Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
• Generate IP related to novel wafer integration & packaging technology.
• Work and collaborate with other teamsregardingdifferent assignments as needed.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.
• Other duties as assigned bymanager.

• Education –Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Scienceor relatedfieldfrom an accredited degree program.
• Prior relatedinternship or co-op experience.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency
  - English (Written & Verbal).
• Travel
  - Up to 10%.

• PhD education level preferred.
• Fundamental knowledge of semiconductor packaging process modules and integration.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills,i.e.,the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planningandorganizational skills.

#NCGProgramUS

$85,000.00 - $

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at  and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case‑by‑case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with Global Foundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

Global Foundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. Global Foundries goal of excellence in…