Design Release Engineer – Semiconductor

DUTIES

Create and maintain deliverables and processes according to the key area assignment of the Compute and Connectivity Design Support Team. Create and manage Engineering Change Requests for GM semiconductor part numbers. Analyze and approve supplier semiconductor resiliency plan submissions. Create and maintain GM semiconductor catalog items as assigned. Create electronic circuit schematics as assigned. Support GM IT and Purchasing semiconductor initiatives.

Develop and maintain templates and tools, support or define enterprise sourcing strategies and business models based on key area of assignment. Work with execution teams to ensure that the GM strategic vision is implemented by design teams in ECU semiconductor component selection. Model and develop GM's Core Values and Winning Behaviors. Telecommuting 100%.

Bachelor's degree in Electrical Engineering, Electronic Engineering, or related field of study. Three (3) years of experience as a Design Release Engineer – Security Gateway, Product Design Engineer, Hardware Test Engineer, Hardware Engineer, or related occupation. Three (3) years of experience with automotive component release process; automotive change management process; product development engineering; product design and development cycles; ECU schematic creation;

hardware validation of ASICs; printed circuit board debugging; PCB thermal validation; creating semiconductor design reference manuals; and creating ECU component technical specifications.

• The expected base compensation for this role is $ to $161,100 Annually.
• Actual base compensation within the identified range will vary based on factors relevant to the position.
• Bonus Potential:
  An incentive pay program offers payouts based on company performance, job level, and individual performance.

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