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Hardware Engineering Intern: SoC & GPU Design

Job in Washington, District of Columbia, 20022, USA
Listing for: QUALCOMM, Inc.
Apprenticeship/Internship position
Listed on 2026-10-02
Job specializations:
  • Engineering
    Hardware Engineer, Test Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 23000 - 135000 USD Yearly USD 23000.00 135000.00 YEAR
Job Description & How to Apply Below
Position: Hardware Engineering Intern: SoC & GPU Design (Relocation)

Qualcomm Technologies, Inc. invites a Hardware Engineering Intern to collaborate on next‑generation devices within the Interns Group.

You’ll join one of several tracks—GPU Engineering, CPU Engineering, Digital Design / DV, or SoC Systems Engineering—using C, C++, Python, Verilog, System Verilog, and related tools on real projects. This 11–14 week summer program offers hands-on experience, mentorship, relocation coverage, furnished housing, and exposure to Qualcomm’s innovation culture, with

This is an excellent role to take on the Hardware Engineering Intern:
SoC & GPU Design (Relocation) role at QUALCOMM, Inc.

Join QUALCOMM, Inc. and contribute to our ongoing work.

Take a moment to read everything above and see whether this role is right for you.

This posting is for the Hardware Engineering Intern:
SoC & GPU Design (Relocation) role at QUALCOMM, Inc., based in United States.

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