Lead of Thermal Systems & Simulation; Semiconductor

Lead Chip Cooling Engineer

Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips. Our customer base includes both household names and startups in emerging industries. Our company was founded by world-renowned leaders in simulation technology from Stanford University and MIT.

Backed by top VC firms, we are poised to disrupt the billion-dollar engineering simulation industry with our fast-growing trajectory.

The semiconductor industry is hitting a "thermal wall." As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Key Responsibilities

• Strategy & Product
  
  Roadmap:
  
  Define how Flexcompute's solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership:
  Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting:
  Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute's simulation platform.
• Market Evangelism:
  Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
• Team Building:
  Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.