Physics AI - Thermal-Mechanical Reliability

Technical Leader For 3D-IC Thermal-Mechanical Reliability Division

Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips. Our customer base includes both household names and startups in emerging industries. Our company was founded by world-renowned leaders in simulation technology from Stanford University and MIT.

Backed by top VC firms, we are poised to disrupt the billion-dollar engineering simulation industry with our fast-growing trajectory.

Our core technology features the world's fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don't just make simulations faster; we make the "impossible" solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond.

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world's fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry's most critical bottleneck: the structural and thermal integrity of advanced packaging.

You will lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. You aren't just using tools; you are defining the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale.