Mechanical Engineer - Electronics Packaging and Rugged Design
Listed on 2026-07-27
-
Engineering
Mechanical Engineer, Manufacturing Engineer, Product Engineer
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Job Title:Staff Mechanical Engineer
- Electronics Packaging and Rugged Design
Location:
Wayne, NJ, US, 07470
Business Unit:
Vision Research
Posting Date:
Jul 4, 2026
The Principal Mechanical Engineer plays a key role in the design and development of Phantom camera electronics packaging, with a strong focus on ruggedization and thermal management. This position requires deep expertise in mechanical engineering, materials science, and cost-effective manufacturing, along with experience delivering reliable products for demanding environments.
Key Responsibilities Design & Development- Lead design of Phantom camera electronics packaging using Solid Works, ensuring performance, reliability, and cost targets are met
- Design chassis, heat sinks, and related accessories, cables, and support equipment
- Develop ruggedized designs for harsh environments (shock, vibration, temperature extremes, moisture)
- Implement effective active and passive thermal management solutions
- Select materials and components balancing performance, durability, and cost
- Partner with procurement and manufacturing to optimize designs for cost-effective production (COGS)
- Oversee prototyping and validation testing to ensure performance and reliability
- Develop test fixtures as needed
- Create detailed engineering documentation, including drawings and ECOs
- Apply configuration control and support product lifecycle management
- Work closely with electrical engineers, product managers, and manufacturing teams to integrate designs
- Drive electro-mechanical tradeoffs to achieve optimal packaging and cooling solutions
- Stay current with industry trends, technologies, and best practices to improve design processes and product performance
- Bachelor's degree in Mechanical Engineering;
Master’s degree preferred - Minimum 10 years of experience in mechanical engineering, with focus on electronics packaging and rugged design
- Proficiency in Solid Works 3D CAD
- Strong knowledge of GD&T principles
- Experience in electronics packaging, cooling, and cross-functional collaboration (EE/ME teams)
- Demonstrated expertise in thermal analysis and active/passive cooling techniques
- Experience with PLM, configuration control, and ECO processes
- Familiarity with FEA for structural and thermal analysis
- Knowledge of materials selection for rugged applications
- Experience with manufacturing processes (CNC, casting, extrusion, injection molding) and DFM
- Demonstrated ability and willingness to useAItools to improve productivity, decision‑making, work quality, and to reduce costs. The successful candidate must be able to identify appropriate AI use cases and critically evaluate AI-generated outputs.
- Strong problem-solving skills and attention to detail
- Ability to manage multiple projects and meet deadlines
- Team‑orientated with strong work ethic and adaptability
- Familiarity with cost analysis and optimization
Vision Research
- Phantom High‑Speed is a Business Unit in the Materials Analysis Division of AMETEK, Inc.
Phantom High‑Speed,designs and manufactures advanced measurement tools that empower engineers, researchers, and innovators to visualize motion too fast for the human eye. Our proprietary CMOS sensor technology delivers unmatched speed, precision, and image quality—making Phantom cameras the trusted choice across science, productdeveloping, defense, and academia- research facilities. With a legacy of innovation dating back to 1950 and a commitment to listening to our customers, Phantom continues to lead the high‑speed imaging industry.
Wedon’tjust capture motion, we help the world understand it.
To learn more, and the diverse applications and markets we serve, please go to .
Disclaimer:
Where a specific pay range is noted, it is a good faith estimate at the time of this posting. The actual salary offered will be based on experience, skills, qualifications, market / business considerations, and geographic location.
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