PWB Designer

PWB Designer

Location:

West Chester, OH, US, 45069 Work Arrangement:
Onsite MPG delivers radio frequency (RF) spectrum-centric solutions at the speed of technology. We enable mission-critical communications and space-based missions with ruggedized RF components, subsystems, and turn-key solutions. Civilian government, military and commercial customers rely on MPG's deep engineering expertise, and scalable manufacturing capability to deliver what they need, when they need it. MPG operates engineering and manufacturing facilities in:
Austin, TX;
Columbia, MD;
Ventura, CA;
West Chester, OH;
Salisbury, MD;
Santo Domingo, Dominican Republic; and York, United Kingdom. As a PWB Designer at Microwave Products Group – Pole/Zero Corporation in West Chester, OH, you will be responsible for the design and development of printed wiring boards for military applications. The designs include RF amplifiers, power supplies, digital controllers, and backplanes. Why work for us? We prioritize innovation and creativity, career advancement opportunities, a collaborative culture, work-life balance, and competitive compensation and benefits.

The backbone behind our collection of outstanding businesses is a team of dedicated employees who protect and enhance our valued reputation for quality and delivering what we promise. Benefits of joining our team! Annual incentive plan (bonus) Paid vacation and sick time Up to 10 paid holidays/year 4 hours voluntary time off to volunteer for your favorite charity Health, dental, and vision insurance, subject to applicable premium deductions Short-term and long-term disability insurance – 100% company paid Other ancillary insurance options available 401(k) retirement account with matching MPG contributions & profit sharing (if applicable) Profit Sharing Plan - potential up to 3% of base salary Educational Reimbursement up to $5,250 per year Gym membership reimbursement up to $120 per year

Primary Responsibilities:

Design of multi-layer PCBs (2 to 18+ layer) double sided boards with multi material stack ups. Design of RF, analog, digital, and mixed-signal boards. Design to military and IPC printed wiring board standards. Create and modify package decals to suit design needs. Design using a mix of SMT and through hole parts. Design using BGA, QFN, and other high-density packages. Responsible for all relevant design documentation.

Knowledge, Skills and Abilities:

Must have familiarity with DxDesigner and PADS Power PCB software and or Altium. Must be detail oriented. Must be able to communicate effectively with electrical and mechanical engineers. Must be able to communicate effectively with fabrication houses for change requests or deviations. Must be able to interpret detailed engineering specs. Excellent communication skills (oral and written) with ability to communicate within all levels of the organization.

Able to adapt methods to solve problems. Must be able to work independently and within a group/team environment. Requirements Include:
High school diploma or GED required. Two-year (Associate's) degree in CAD-related field from an accredited college or university and 5+ years of experience in CAD OR 10+ years of high level experience in CAD required. Knowledge of CAD software required. CID or CID+ a plus. Experience with RF based systems a plus. Experience with military standards and specifications a plus.

Must be a US person (US Citizen or Permanent Resident - Green Card Holder)