Senior Process Engineer

POSITION:
Senior Process Engineer

REPORTS TO:

Vice President of Engineering

LOCATION:

Westborough, MA.

GENERAL FUNCTION:
The Senior Process Engineer will lead the development, optimization, and scale-up of our micro-LED display manufacturing technology. Responsibility includes extensive hands-on experience in die-level bonding techniques, with a deep understanding of the full semiconductor process flow, including lithography and metal deposition. This position plays the lead role in both prototype fabrication and transferring technology from R&D to high-volume manufacturing.

JOB DUTIES AND RESPONSIBILITIES:

* Develop, characterize, and optimize indium bump formation processes:

* Vacuum deposition (sputtering/evaporation) of under bump metal (UBM) and Indium

* Photolithography and lift-off patterning

* Bump geometry, pitch scaling, and bump surface quality

* Lead the process development of thermo-compression bonding for Chip-to-chip/die-to-die application:

* Design, execute, and analyze Design of Experiments (DOE) to characterize process windows, identify key control parameters, and improve bond yield, uniformity, and reliability.

* Perform root cause analysis for bonding-related failures (e.g., misalignment, non-contact, cracked die, high resistance) using SEM, FIB, X-ray and electrical testing

* Collaborate closely with equipment suppliers to perform both Indium bumping process and bonding trials at equipment vendor sites (travel required).

* Responsible for new tool qualifications, oversee preventative maintenances.

* Interface with chip and wafer supplier to ensure incoming material quality and compatibility with the bonding process.

* Develop and document robust process specifications, work instructions, and training materials for technicians.

* Implement Statistical Process Control (SPC) methodologies to monitor process stability and drive continuous improvement initiatives.

* Remains current with the latest advancements in advanced packaging, bonding techniques, and mass transfer technologies.

MINIMUM

JOB QUALIFICATIONS:

* Kopin is a defense contractor and is subject to International Traffic in Arms Regulations (ITAR). You must be a US Citizen or Permanent Resident (green card holder) to be considered for this position.

* A Bachelor of Science with exceptional demonstrated experience will be considered. M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field, preferred.

* 8+ years of hands-on experience in semiconductor process engineering, with a specific focus on die-level bonding, advanced packaging, or assembly.

* Proven, in-depth experience with one or more of the following is strongly preferred:

* Indium bumping process

* Thermo-Compression Bonding (TCB)

* Flip-Chip Attach process and materials

* Strong experience with bonding metrology and failure analysis techniques (C-SAM, X-ray, SEM/EDX, bond pull/shear testing).

* Strong foundational experience in other key semiconductor unit processes:

* Lithography:
Hands-on experience with photoresist processing (coat, expose, develop), overlay registration, and critical dimension control. Knowledge of steppers/scanners is essential.

* Metal Deposition:
Practical knowledge of Physical Vapor Deposition (PVD) techniques such as sputtering and evaporation for depositing adhesion layers, diffusion barriers, and seed layers (e.g., Ti, Cu, Al).

* Working Knowledge of silicon wafer dicing and coring processes, experience in wafer-to-chip singulation, yield improving, and minimizing die damages through data-driven process engineering.

* Proficiency in data analysis tools such as JMP, Minitab and experience with SPC and DOE.

* Deep understanding of interface science, solder metallurgy, and intermetallic compound (IMC) formation.

* Exceptional problem-solving skills and a data-driven, analytical approach to root cause investigation.

* Meticulous attention to detail and a relentless focus on yield and quality.

* Strong ability to work collaboratively in a cross-functional team environment.

* Excellent communication skills for effectively reporting findings and recommendations to both technical and management/leadership audiences.

* Self-motivated and capable of managing multiple projects in a fast-paced, startup-like environment.

PREFERRED

JOB REQUIREMENTS:

* M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field preferred. A Bachelor of Science with exceptional demonstrated experience will be considered.

* Direct experience in Micro-LED, LED, or photonics fabrication and integration.

* Experience with thin-film transistor (TFT) backplane integration.

* Knowledge of wafer-level packaging processes.

* Experience in a high-volume manufacturing (HVM) environment and bringing processes from NPI to production.

* Familiarity with equipment from key vendors in the bonding and packaging space.

PHYSICAL REQUIREMENTS:

* Work is performed in an office environment and…