Senior Electrical Engineer Speed Digital & RF Hardware Integration

Candidate should live within driving distance of the following areas:
Wichita, KS;
Lawton OK; or Round Rock, TX

The Senior Electrical Engineer supports the rapid development of next-generation, AI-enabled hardware and sensor platforms for counter-UAS (cUAS) and multi-sensor applications. This role creates the board-level hardware foundation that enables future capabilities.

The engineer will design high-speed digital, mixed‑signal, and RF‑supporting electronics. This includes integrating embedded processors, programmable logic, transceivers, clocks, power systems, and board-level interfaces. The engineer will support hardware from early architecture through prototype, lab test, and field validation.

Working closely with FPGA, embedded software, RF, DSP, mechanical, and application software engineers, this role helps transform new hardware concepts into modular, mission‑ready capabilities. The ideal candidate will be excited to work in a fast‑moving R&D environment, solve challenging hardware problems, and help build technology that moves quickly from concept to real‑world impact.

• Design high-speed digital and mixed‑domain PCBs for RF and multi‑sensor platforms.
• Architect board‑level hardware around FPGAs/SoCs, RF transceivers, ADCs/DACs, MCUs, memory, clocks, power, and high‑speed interconnects.
• Create schematics, BOMs, layout constraints, design notes, and release packages using tools such as Altium.
• Support interfaces such as PCIe, USB, Ethernet, SFP/QSFP
  28, JESD
  204, QSPI, I2C, RS-422, and similar board‑level buses.
• Develop clocking, synchronization, reset, and power‑sequencing approaches for coherent sensors and high‑throughput data paths.
• Collaborate with FPGA and embedded software engineers to define clean hardware interfaces, bring‑up paths, debug hooks, control signals, and data‑movement needs.
• Collaborate with RF engineers on mixed‑domain partitioning, RF/digital layout, transceiver integration, signal integrity, power integrity, and EMI/EMC considerations.
• Bring up new boards using oscilloscopes, logic analyzers, spectrum analyzers, VNAs, power analyzers, protocol analyzers, and related lab tools.
• Troubleshoot hardware, firmware, and system‑level issues from bench prototypes through integration and field testing.
• Iterate designs quickly based on test results, evolving requirements, manufacturing feedback, and field observations.
• Support design reviews, DFM/DFT activities, vendor coordination, prototype builds, and transition from proof‑of‑concept hardware toward reusable platform designs.
• Keep schematics, layout files, test plans, bring‑up notes, validation results, and engineering documentation clear and current.

• Eligible to obtain a U.S. Security Clearance – U.S. Citizenship required.
• B.S. in Electrical Engineering, Computer Engineering, or related technical field.
• 5+ years of experience designing high‑speed digital, mixed‑signal, embedded electronics, FPGA/SoC carrier boards, RF‑adjacent hardware, or similar systems.
• Strong schematic capture and PCB design experience;
  Altium experience preferred.
• Working knowledge of high‑speed serial design, differential signaling, controlled impedance, stack‑up planning, timing, clocking, reset, and board‑level signal integrity.
• Experience with power supplies, power sequencing, power integrity, thermal constraints, and dense embedded hardware design.
• Ability to design hardware that supports FPGA/SoC integration, ADC/DAC or sensor interfaces, memory, PCIe/DMA‑capable data paths, and application‑facing control needs.
• Hands‑on board bring‑up and troubleshooting experience with common lab and test equipment.
• Ability to read datasheets, schematics, layout constraints, interface specifications, and system requirements, then turn them into practical hardware designs.
• Clear communicator who documents decisions and works well across electrical, FPGA, embedded software, RF, DSP, mechanical, and systems teams.

• Experience with AMD/Xilinx, Intel/Altera, or other FPGA/SoC platforms, carrier boards, SOMs, RFSoC‑class devices, or high‑pin‑count digital designs.
• Experience with PCIe, USB 3.x, 10G/40G Ethernet,…