Mixed-Signal Chiplet Architect

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™.

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We are seeking a highly skilled Mixed-signal IC Chiplet Architect to lead the definition, design, and integration of next-generation chiplet-based analog and mixed-signal transceivers. This role requires deep technical expertise in analog integrated circuit design, system partitioning, and heterogeneous integration. The ideal candidate will provide architectural leadership from concept through product delivery, working cross-functionally with design, packaging, verification, software, firmware, evaluation and device test as part of a system engineering team.

• Architecture & Specification
  • Define the architecture of analog and mixed-signal transceiver chiplets for advanced heterogeneous integration.
  • Develop system-level specifications, interface definitions, and performance requirements.
  • Develop sub-system requirements within the chiplet to achieve system level performance goals.
  • Work with software architects to define and develop software and firmware for fast configuration and real time chiplet control.
• Design Leadership
  • Guide design teams in integrating analog building blocks (e.g. RFADCs/RFDACs, Bias circuits, clock structures, PLLs, LDOs, drivers).
  • Collaborate with digital, RF, and packaging teams to ensure seamless chiplet operation and interoperability.
  • Work with system engineers to define and integrate fast switching clock synchronization schemes.
• Integration & Verification
  • Work with 2D/2.5D integration teams to define chiplet interconnect requirements and physical integration strategies.
  • Oversee system-level verification, modeling, and simulation of multi-chiplet systems.
  • Drive signal integrity, power integrity, and thermal considerations at the multi-chiplet level.
• Innovation & Road mapping
  • Stay at the forefront of industry trends in chiplet architectures, heterogeneous integration, and advanced packaging.
  • Contribute to the company’s technology roadmaps, identifying opportunities for differentiation in performance, efficiency, and scalability.
• Collaboration & Mentorship
  • Act as a technical leader, mentoring junior engineers and influencing best practices in mixed-signal IC design and chiplet integration.
  • Communicate complex trade-offs and recommendations to management.

• Education:
  • MS or PhD in Electrical Engineering or Systems Engineering.
• Experience:
  • 10+ years of experience in analog/mixed-signal IC design, with at least 3 years in chiplet or multi-die system architecture.
  • Track record of architecting and delivering high-performance analog ICs.
  • Experience with advanced packaging and chiplet-based integration.
• Technical Expertise:
  • Strong foundation in analog/mixed-signal circuit design (ADC/DACs, Clocking, Biasing, Digital, and software/firmware based control).
  • Knowledge of die-to-die interconnect protocols a plus.
  • Familiarity with EDA tools for circuit, system, and packaging co-simulation.
• Soft Skills:
  • Strong leadership, problem-solving, and communication skills.
  • Ability to balance innovation with practical constraints in time-to-market and manufacturability.

This is a opportunity to shape the future of chiplet-based architectures in a rapidly evolving semiconductor landscape. You will work on cutting-edge technologies, influence next-generation system designs, and have direct impact on products that push the boundaries of performance and integration.

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