Equipment Engineering

Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™.

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Join ADI’s MEMS fabrication team to keep critical manufacturing equipment in Photo, Wafer Bond, and Etch areas running safely, reliably, and at peak performance. You’ll execute preventive maintenance, troubleshoot issues to root cause, partner with Process Engineering and Operations, and drive continuous improvement projects that increase tool uptime, yield, and throughput.

Key Responsibilities

• Equipment Ownership & Uptime:
  Perform scheduled PMs, calibrations, and health checks; respond to tool downs and restore to production safely and quickly.

• Troubleshooting & Root Cause:
  Diagnose mechanical, electrical, vacuum, pneumatics, and software/ controls issues; document findings and implement corrective actions (5‑Why , RCFA ).

• Photo Area Support:
  Support coaters/developers, aligners/steppers, and metrology associated with lithography; partner with ops to optimize recipes and reduce constraints/wait time.

• Bond Area Support:
  Support wafer bonding equipment (e.g., thermal/adhesive/Anodic bonding tools); maintain tool safety interlocks, fixtures, and process hardware.

• Etch Area Support:
  Support dry/wet etchers (e.g., plasma/RIE/ICP and cleans); monitor error rates and chamber health, update PM specs and checklists.

• Documentation & Standards:
  Update maintenance procedures, PM checklists, BKMs and specifications; keep CMMS/Work Orders current with accurate parts usage and notes.

• Continuous Improvement (TPM):
  Analyze repeat faults/trouble list data, lead small DI projects, and present action plans to the area team.

• Safety & Compliance:
  Follow cleanroom protocols and EHS procedures including Lockout/Tagout (LOTO) and hazardous materials handling; keep work area organized and safe during/after maintenance.

• Cross‑Functional
  
  Collaboration:
  
  Work closely with Process Engineering, Operations, Facilities, and vendor field service to schedule activities and minimize production impact.

• Bachelor’s in Electrical , Mechanical, Chemical Engineering, Materials Science, Physics or related field; or Associate’s + 1-2 years’ relevant semiconductor/cleanroom experience.

• Hands‑on aptitude with tools, test equipment (DMMs, oscilloscopes, leak detectors), and reading schematics/mechanical drawings.

• Fundamental knowledge of cleanroom practices and equipment maintenance basics (vacuum systems, gas delivery, motion control).

• Strong problem‑solving, attention to detail, and communication skills; ability to document procedures and results clearly.

• Exposure to photolithography, wafer bonding, or etch tools (internships, co‑ops, or coursework).

• Experience with PM execution, RCFA/5‑Why, SPC basics, and collaborating with vendors/field service.

• Familiarity with CMMS/work order systems and updating PM checklists/BKMs.