System Mechanical & Integration Engineer

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible.

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Analog Devices’ High Voltage & Protection team is seeking a Systems Integration Engineer to support the development of next-generation data center power delivery solutions. In this role, you will work alongside experienced power electronics, thermal, mechanical, systems, and reliability engineers to design, integrate, and validate high-density power supply systems for AI and cloud computing infrastructure. The focus will be on mechanical architecture development, thermal management, enclosure design, busbar integration, manufacturability, and system-level validation of high-power server and rack-level power solutions.

• Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB).
• Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations.
• Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials.
• Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6
  
  SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability.
• Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features.
• Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components.
• Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements.
• Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues.
• Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions.
• Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement.

• MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field.
• 3+ experience with Strong foundation in multiple areas spanning:
  Mechanical design and product development;
  Thermal management of electronic systems;
  System integration of power electronics platforms.
• Candidates with additional experience may be considered at the Senior Engineer level.
• Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
• Experience with CAD tools such as Creo, Solid Works, NX, or CATIA.
• Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
• Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
• Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
• Strong analytical and problem-solving skills with a hands‑on approach to…