Principal IC Analog​/Mixed Signal Design Engineer

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible.

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Analog Devices is seeking a Principal Analog/Mixed-Signal IC Design Engineer for its Data Center & Energy (DCE) group in Wilmington, MA. Within DCE, we develop high-reliability power, connectivity, and analytics solutions for hyperscale data center platforms: mixed-signal SoCs combining precision analog front-ends, high-speed data converters, and embedded processing in advanced FinFET process technologies. The successful candidate will lead analog and mixed-signal circuit design from architecture through silicon validation in deep submicron FinFET processes.

This is a principal-level role: a recognized technical authority who drives system-level tradeoffs and whose design decisions directly impact product performance, power, area, and manufacturability. The role carries both hands‑on design ownership and technical leadership of junior and senior engineers. This is a hands‑on technical leadership position with significant breadth, spanning precision voltage sensing, high‑speed data conversion, power regulation, and mixed‑signal integration.

The team works across multiple process nodes and product generations in a collaborative, fast‑paced environment.

• Own analog architecture and circuit design for complex mixed‑signal SoC subsystems: precision voltage sense paths, high‑speed and low‑speed ADC front‑ends, voltage references, regulators, bias generation, and I/O interfaces
• Transistor‑level design, simulation, and optimization in deep submicron FinFET processes; management of device‑level tradeoffs (leakage, mismatch, reliability, electromigration)
• Drive system‑level analog/digital partitioning decisions; define and validate specifications at the block, subsystem, and SoC level
• Lead mixed‑signal verification including behavioral modeling, co‑simulation with digital, and corner/Monte Carlo analysis
• Collaborate with layout, DFT, and test engineering to ensure robust DFM and production testability; support silicon bring‑up, characterization, and debug
• Provide technical mentorship and design review leadership; establish reusable IP and best practices
• Collaborate with cross‑functional teams (architecture, digital, firmware, applications, customers) to translate system requirements into analog specifications and robust, manufacturable solutions
• Contribute to product roadmaps, patent portfolio, and ADI's analog design methodology improvements

• The ideal candidate combines deep analog circuit design expertise with hands‑on experience in FinFET process technologies. They are self‑directed, technically rigorous, and comfortable leading design tradeoffs in a multi‑disciplinary SoC environment.
• MSEE or PhD preferred; BSEE with 12+ years of analog/mixed‑signal IC design experience considered
• Demonstrated track record of silicon‑proven designs in deep submicron FinFET processes; deep understanding of device physics, mismatch, leakage management, and reliability at advanced nodes
• Experience designing precision analog circuits: voltage references, regulators, ADC front‑ends, bias generators, comparators, or similar
• Proficiency with industry EDA tools (Cadence Virtuoso, Spectre, AMS simulation environments)
• Experience taking designs from specification through layout, tapeout, silicon bring‑up, and production release
• Strong written and verbal communication skills; ability to present design reviews and technical tradeoffs to cross‑functional audiences
• Experience mentoring engineers and leading design reviews
• Familiarity with DFT, production test, and design‑for‑manufacturability…