Thermal Architect

Cooling performance limits high‑power computing, semiconductor fab, cell networks, photonics, power electronics, and most of our digital world. JCI enables customers to break through these constraints with novel complex metal components that dramatically improve heat dissipation in high‑performance systems. JCI’s patented Stack Forging™ process enables complex micro‑geometries, resulting in single‑piece, leak‑tight parts that deliver superior cooling performance, lower pressure drops, and exceptional reliability.

As a Thermal Architect at JCI, you will be a technical authority on thermal management, serving as a critical link between our customers' most complex challenges and our core technology. You are a thermal expert who thrives on architecting cutting‑edge, system‑level solutions and translating them into manufacturable realities. You will be responsible for driving the technical strategy from initial feasibility and concept development through to successful implementation, working with cross‑functional teams, and ensuring our solutions deliver unparalleled performance.

The ideal candidate has a deep background in thermal management and fluid dynamics, possessing a proven track record in leading advanced product and engineering efforts.

This role generally requires 4 days onsite per week.

• Lead the development and validation of next‑generation thermal‑fluid architectures, pushing the boundaries of our core technology and mapping capabilities to customer needs.
• Perform analysis and feasibility assessments to validate novel concepts and quantify performance benefits for customer applications.

• Evaluate customer requirements against JCI technologies to define new thermal solutions.
• Assess technical trade‑offs and risk mitigation strategies to ensure solutions are delivered on time and meet performance and reliability standards.

• A Master's degree in Mechanical Engineering, Aerospace Engineering, Physics, or a related field with a focus on thermal‑fluid sciences.
• 7–10 years of industry experience
• Demonstrable expertise in thermal management and liquid cooling, preferably with experience in data centers or high‑performance computing.
• Demonstrated ability to architect technical solutions and lead advanced engineering projects from concept to completion.
• Strong communication and presentation skills, with the ability to convey complex technical concepts to both technical and non‑technical audiences.

• Ability to align technical development with strategic business priorities.
• A background in customer‑facing technical roles (e.g., principal engineer, technical fellow, or senior applications engineer).
• Experience in a manufacturing setting.
• Expertise in design for manufacturability (DFM) principles, especially related to metal components or thermal systems.
• Familiarity with thermal simulation software (e.g., CFD) and analytical modeling.

HIRING SALARY RANGE: $110000 - $140000. Salary to be determined by the education, experience, knowledge, skills, and abilities of the applicant, internal equity, and alignment with market data. This position includes a competitive benefits package. The posted salary range reflects the target compensation for this role. However, we recognize that exceptional candidates may bring unique skills and experiences that exceed the typical profile.

If you believe your background warrants consideration beyond the stated range, we encourage you to apply. To support an efficient and fair hiring process, we may use technology assisted tools, including artificial intelligence (AI), to help identify and evaluate candidates. All hiring decisions are ultimately made by human reviewers. For details, please visit the About Us tab on the Johnson Controls Careers site at