Mechanical Engineer

Job Description:

Mechanical Engineer - Principal Electromechanical Engineering (Electronic Packaging & Payload Systems)

This senior-level Principal Electromechanical Engineering role focuses on leading the design and integration of electronic packaging and payload systems, with an emphasis on circuit card assembly (CCA) packaging, payload electronics, and subsystem integration. The Mechanical Engineer provides strategic technical direction, drives innovation in electromechanical design, and delivers hands-on expertise across multiple complex engineering programs. This position plays a key leadership role in ensuring that payload electronic control assemblies and subsystem hardware meet structural, thermal, and mechanical performance requirements while supporting program objectives.

Responsibilities

+ Lead the development and execution of mechanical and electromechanical design solutions for payload electronic control assemblies (ECAs) and subsystem hardware.

+ Oversee mechanical requirements analysis for complex engineering programs and define technical strategies that align with program and system-level objectives.

+ Ensure designs comply with structural, thermal, and mechanical requirements through detailed reviews, structural analysis, and thermal analysis.

+ Provide technical leadership and mentorship to cross-functional engineering teams, fostering collaboration and knowledge sharing.

+ Lead formal design reviews and support risk identification, assessment, and mitigation activities throughout the product lifecycle.

+ Develop, review, and approve mechanical drawings, engineering documentation, and test fixtures to support development, verification, and production.

+ Collaborate closely with procurement teams and external vendors to source materials and components that meet design, cost, and schedule targets.

+ Support hardware integration, testing, and validation activities across multiple programs, ensuring successful subsystem and payload integration.

+ Drive continuous improvement initiatives and promote best practices in electromechanical engineering, electronic packaging, and subsystem design.

+ Apply expertise in electronic packaging, circuit card assembly (CCA) packaging, and payload integration to optimize performance, reliability, and manufacturability.

+ Coordinate with multidisciplinary stakeholders to interpret complex requirements and translate them into robust, practical design solutions.

+ Contribute to and support formal engineering release and documentation processes to maintain configuration control and product integrity.

Essential Skills

+ Bachelor's degree in Mechanical Engineering or a related engineering field.

+ Typically 5+ years of experience in electromechanical system design.

+ Strong expertise in electronic packaging, including circuit card assembly (CCA) packaging and payload electronic control assemblies.

+ Proven experience in structural analysis and structural integrity assessment for mechanical and electromechanical systems.

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Demonstrated proficiency in thermal analysis for electronic packaging and payload systems.

+ Ability to interpret complex technical and program requirements and translate them into effective mechanical and electromechanical design solutions.

+ Experience working within cross-functional engineering teams and program-driven environments.

+ Strong communication and collaboration skills to effectively interface with engineering, procurement, vendors, and program stakeholders.

+ Ability to obtain and maintain a TS/SCI security clearance with polygraph.

+ U.S. citizenship (required for security clearance eligibility).

Additional

Skills & Qualifications

+ Advanced degree in Mechanical Engineering or a related field (may substitute for a portion of required experience).

+ Active TS/SCI security clearance with polygraph.

+ Extensive experience in electronic packaging and payload integration, preferably within aerospace or defense environments.

+ Proficiency with NX or similar CAD tools for mechanical and electromechanical design.

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Experience with MPLM systems and formal engineering release processes.

+ Familiarity with formal engineering documentation practices,…