Principal​/Sr. Principal Engineer Mechanical

Relocation assistance may be available.

Clearance required for start:
Yes. Clearance type: SAP.

Travel:
Yes, 10% of the time.

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Corporation is offering a challenging and rewarding career as a Mechanical Engineer within the Mission Systems Sector located at the Rolling Meadows, Illinois facility.

This position will support the development, build, and test validation of ruggedized electronic equipment for military applications. The candidate will work within the Hardware Engineering organization and will serve on and typically lead engineering teams, interfacing heavily with other mechanical engineers and analysts, as well as engineers from related disciplines, program management, and customers/stakeholders. The engineer is expected to manage schedule and budget for assigned projects, with the ability to identify and communicate any issues that may impact these goals.

• Solve challenging technical problems with innovative solutions that meet performance, cost, and schedule requirements.
• Demonstrate expertise in at least one of the following specific technical skills: advanced thermal analysis, advanced structural analysis, microelectronics design, aircraft modification (Group
  
  A) design, or opto-mechanical design.
• Apply expertise at any phase of the product life cycle, including requirements analysis, concept design, detailed design, manufacture, and environmental test.
• Contribute to overall knowledge base and skill level of the organization via coaching, knowledge transfer, and process improvement activities.

• Bachelor of Science degree in Mechanical or Aerospace Engineering with a minimum of 5 years of experience in electronics packaging or a Master’s degree with 3 years of experience.
• Extensive experience with hardware development and electro-mechanical packaging, including at least one of the following subjects: thermal analysis, structural analysis, microelectronics design, opto-mechanical design, environmental testing.
• Proficiency with 3D CAD Tools (Siemens NX is preferred) and product data management tools.
• Demonstrated leadership of small to moderately sized teams during the product development process including the review of technical work products.
• Demonstrated application of innovative solutions to complex problems that arise within the design, development, and production phases.
• Strong written, verbal and interpersonal communication skills including experience presenting at design reviews and customer/stakeholder briefings.
• Displayed ability to exercise latitude in determining most appropriate technical approach of assignments.
• U.S. citizen.
• Ability to obtain and maintain a minimum of a Secret Clearance with additional customer specified clearance prior to start.

• Bachelor of Science degree in Mechanical or Aerospace Engineering with a minimum of 8 years of experience in electronics packaging or a Master’s degree with 6 years of experience.
• Demonstrated expertise in at least one of the following subjects: advanced thermal analysis, advanced structural analysis, microelectronics design, group A design, or opto-mechanical design.
• Expertise in mechanical design and/or analysis tools.
• Demonstrated application of innovative solutions to complex problems.
• Experience…